Minoru — Thermal Management & EMI Materials in Thailand
Thermal Pads, Silicone-Free Thermal Materials, Gap Fillers, PCM, Thermal Tape and EMI Materials
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We offer two different types of tower lights: modular and pre-configured. The modular signal tower offers optimum flexibility and a large selection of modules, while the pre-configured stack light consists of just one article number and is ready configured for immediate use. Both options can be adapted exactly to the needs of your company
Thermal pads are solid insulating materials with high-efficiency heat dissipation performance. They work by filling the microscopic air gaps formed by surface roughness between heat-generating components and heat sinks, significantly reducing contact thermal resistance. LiPOLY offers thermal pads in a variety of specifications — samples are available upon request
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320xxF / 330xxF Conductive Fabric Tape
Electrically Conductive Copper Tape not only provides shielding performance but also enhances the physical properties of the tape for good workability.
510xx / 610xx Thermal Conductive Tape
MINORU thermal conductive tape are designed to have good converting ability, handling and re-workability through the introduction of a ultra thin PET carrier
5505 / 5507 / 5508 / 5510 PCM Thermal Pad
5505-xx&5507-xx&5508-xx&5510-xx series are phase change thermal pad
CUxx Conductive Foil Tape
Electrically Conductive Copper Tape not only provides shielding performance but also enhances the physical properties of the tape for good workability.
JTGAxx Acrylic Thermal Pad (Silicone-Free)
MINORU Thermally Conductve Acryic Interface Pad JTGAxx series are designed to provide a preferental heattransfer path between heat generating components and heat sinks, heat spreaders or other cooling device
JTGAxxSNT Ultra-Soft Acrylic Thermal Interface Sheet
MINORU® Acrylic Thermal Interface Sheet JTGAxxSNT Series is designed to optimize the heat transfer path between heat-generating components and cooling devices such as heat sinks, and is composed of a flexible acrylic elastomer containing thermally conductive ceramic particles.
LFS / AHG / AH EMI Absorber Series
MINORU EMI Absorber materials are composite material consisting of a carrier resin and magnetic fillers and an acrylic pressure sensitive adhesive
SFP02 / SFP04 / SFP06 Silicone-Free Gap Filler
The MINORU SFPxx series is a one-component, silicone-free thermal gap filler
TGxx Silicone Thermal Pad
MINORU TGxx series thermally conductive PAD can used between electronic devices and heat sink interfaces.