Product Description
TGF series is a thermally conductive Gap Filler. With special formula, it has low volatility characteristics and anti-cracking, anti-drape characteristics, especially for the many electronics applications. It is ultra-soft and has good tack which is easy to rework and easy for assembly.
Characteristics:
- One-component material, no post-curing, suitable for automated operation
- High reliability and thermal stability
- Low oil penetration properties, no pump-out
- Soft, low assembly pressure and low residual stresses
Application Fields:
- Automotive Electronics
- Power switches
- Motor Control
- Power Semiconductors
- Power Modules
- Mass Storage Data Centre
- Memory modules
- Smart terminals, mobile phones, tablet PCs
One Part Thermal Gap Filler TGFxx Series
| Property | TGF03 | TGF05 | TGF07 | TGF09 | TGF10 | TGF12 | Test method |
| Construction | Ceramic filled silicone | Ceramic filled silicone | Ceramic filled silicone | Ceramic filled silicone | Ceramic filled silicone | Ceramic filled silicone | − |
| Color | Pink | Green | Grey | Red | Grey | Green | — |
| Minimum Bond Line Thickness (mm) | 0.04 | 0.05 | 0.1 | 0.12 | 0.2 | 0.2 | − |
| Density (g/cc) | 3. 02 | 3.19 | 3. 21 | 3. 23 | 3. 71 | 4.1 | ASTM D792 |
| Heat capacity(J/g·K) | 1.1 | 1.2 | 1.2 | 1.23 | 1.29 | 1.32 | ASTM E1269 |
| Flow Rate (g/min) | 19 | 19 | 12 | 10 | 10 | 10 | |
| Outgassing (%) | <0. 01 | <0. 01 | <0. 01 | <0. 01 | <0. 01 | <0. 01 | ASTM E595 |
| Operating Temperature Range (°C) | -50°C∽200°C | -50°C∽200°C | -50°C∽200°C | -50°C∽200°C | -50°C∽200°C | -50°C∽200°C | − |
| Dielectric Strength (Kv/mm) | >9.0 | >9.0 | >9.0 | >9.0 | >9.0 | >9.0 | ASTM D149 |
| Dielectric Constant (1GHz) | 6.8 | 7.1 | 7.3 | 9.1 | 8.8 | 9.7 | ASTM D150 |
| Flame Rating | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | UL 94 |
| Thermal Conductivity ( W/m-K) | 3.0 | 5.0 | 7.0 | 9 | 10 | 12 | ASTM D5470 |
| volume resistance ohm-cm | ＞1013 | ＞1013 | ＞1013 | ＞1013 | ＞1013 | ＞1013 | ASTM D257 |
