Masstech Global Co., Ltd.

JTGAxxSNT Ultra-Soft Acrylic Thermal Interface Sheet

MINORU® Acrylic Thermal Interface Sheet JTGAxxSNT Series is designed to optimize the heat transfer path between heat-generating components and cooling devices such as heat sinks, and is composed of a flexible acrylic elastomer containing thermally conductive ceramic particles.

Product Category

Product Description

MINORU® Acrylic Thermal Interface Sheet JTGAxxSNT Series is designed to optimize the heat transfer path between heat-generating components and cooling devices such as heat sinks, and is composed of a flexible acrylic elastomer containing thermally conductive ceramic particles. As an innovative silicone-free thermal management material, it guarantees zero siloxane release during long-term use, effectively preventing potential damage to precision electronic devices, especially chips. Thanks to the flexibility of this series, hardness levels as low as ASKER C 5 can be achieved, enabling seamless adhesion under extremely low stress while maintaining high thermal dissipation performance.

Features

  • High thermal conductivity and good electrical insulation properties.
  • Superior flexibility ensures excellent conformability to non-planar surfaces.
  • Allows temporary pre-fixation through slight tackiness. High wettability reduces thermal resistance.
  • Silicone-free design eliminates siloxane gas generation, preventing contact failures.

MINORU Product Naming Convention

20260801谷歌网站-丙烯酸垫片新增内容英(2)(1)_02

Product Structure

Single-Sided Tack JTGAxxSNT-xx Series (Ultra-Soft Hardness)

 

20260801谷歌网站-丙烯酸垫片新增内容英(2)(1)_03

General Properties (Typical Values)

ITEMS JTGA15SNT JTGA20SNT JTGA30SNT JTGA40SNT TEST

METHOD

※Thermal Conductivity (W/m·K) 1.5 2 3 4 ASTM D5470
Thickness(mm) 0.5mm〜12mm 0.5mm〜12mm 0.5mm〜12mm 0.5mm〜12mm
Color White
Density (g/cm3, @ 25°C) 2.52 2.69 2.78 3.0
※Hardness 35 35 45 45 Shore 00
※Hardness 5 5 5 5 Asker C
Volume Resistivity(Ω-cm) >1*1012 >1*1012 >1*1012 >1*1012 ASTM D257-14
Dielectric Strength (kV/mm) 1mm >10 >10 >10 >10 ASTM D149-09
Dielectric Constant 1MHz 6.57 6.72 6.80 6.85 ASTM D150-11
Tensile Strength(MPa) 0.1 0.1 0.1 0.1 JIS K 6251
UL94 V-0 Equivalent UL
Working Temperature (°C) -40°C~130°C

Disclaimer: The technical parameters listed above are typical values and not guaranteed specifications.

※* Thermal conductivity and hardness are measured only for the thermally conductive acrylic layer (tacky).

Application ideas

20260801谷歌网站-丙烯酸垫片新增内容英(2)(1)_04

 

 

 

Rerate Products

TGF One-Part Silicone Gap Filler

TGF series is a thermally conductive Gap Filler

H-PUTTY Thermal Putty

Thermal Putty 3.5W/m·K No Vertical Flow

BS89-s Ultra Soft Thermal Pad

Ultra Soft Thermal Pad 5.0W/m·K

T-WORK9000 Thermal Pad 20 W/m·K

Thermal Pad 20 W/m·K
Scroll to Top