Product Description
The MINORU SFPxx series is a one-component, silicone-free thermal gap filler. Formulated to be silicone-free, it features excellent crack and sag resistance, ensuring compatibility with a wide range of electronic devices. Once cured, it maintains a flexible texture with moderate tack, providing outstanding reworkability and assembly performance.
Features
- Single-component material; no secondary curing required, making it ideal for automated production.
- Superior flexibility and extremely low residual stress, optimized for low-pressure assembly.
- High reliability with exceptional thermal stability.
Handling Precautions
- Fire Safety: Keep product storage and installation areas away from open flames or ignition sources.
- Verification: Thoroughly verify product suitability and compatibility for your specific application prior to full-scale operation.
- Surface Preparation: Ensure the bonding interface is clean and free of contaminants (dust, oil, or debris) before application.
- Dispensing: We recommend using a pneumatic dispensing machine for direct application; alternatively, use an equivalent direct coating process.
Why choose silicone-free products?
Application ideas
| Property | SFP02 | SFP04 | SFP06 | TEST METHOD |
| Thermal Conductivity( W/m-K) | 2 | 4 | 6 | ASTM D5470 |
| Product Type | Silicone-Free, One Part | Silicone-Free, One Part | Silicone-Free, One Part | − |
| Color | Gray | Pink | Blue | − |
| Density@25°C(g/cc) | 2.8 | 3.3 | 3.25 | − |
| Flow Rate(g/min) | 50 | 40 | 10 | − |
| Outgass(3hrs@125°C) | 0.01% | 0.01% | 0.01% | − |
| Typical adhesive layer thickness Min(mm) | 0.03 | 0.05 | 0.2 | − |
| Volume Resistivity ohm-cm | 10¹³ | 10¹² | 10¹¹ | ASTM D257 |
| Dielectric Strength (Kv/mm) | 8 | 7 | 6 | ASTM D149 |
| thermal resistance（°C-cm²/W） | 0.35 | 0.55 | 0.33 | ASTM D5470 |
| Working Temperature (°C) | -40°C〜130°C | -40°C〜130°C | -40°C〜130°C | − |
