Datasheet Download
T-top99-s Extreme Thermal Pad is an ultra-high thermal conductivity pad with a thermal conductivity of 24.0 W/m*K. It features excellent electrical insulation, compressibility, and flexibility characteristics, specifically designed for uneven surface applications, capable of filling micro gaps and reducing contact thermal resistance.
FEATURES
- Thermal Conductivity：24.0 W/m·K
- High compression rate
- Extremely low thermal impedance
- Excellent insulator
CONFIGURATIONS
- Sheets form
- Die-cuts parts
TYPICAL APPLICATION
- Between CPU and heat sink
- Between a component and heat sink
- Flat-panel displays
- Power supplies
- High speed mass storage drives
- Telecommunication hardware
- 5G base station & infrastructure
- High-end Chip
Thermal Pads with Other Thermal Conductivity Ratings
- 2 W/m·K：PK223
- 4 W/m·K：PK404
- 5 W/m·K：PK504
- 6 W/m·K：PK605
- 7 W/m·K：PK700
Ultra-High Thermal Conductivity Thermal Pad
- 8 W/m·K：T-top81-s
- 11 W/m·K：T-work7000
- 13 W/m·K：T-top91-s
- 15 W/m·K：T-work8000
- 18 W/m·K：T-top98-s
- 20 W/m·K：T-work9000
- 24 W/m·K：T-top99-s
T-top99-s Thermal Resistance vs. Pressure vs. Compression
TYPICAL PROPERTIES
| Item | T-top99-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray | – | Visual |
| Surface tack 2-side/1-side | 2 | – | – |
| Thickness | Customized | mm | ASTM D374 |
| Density | 3.3 | g/cm³ | ASTM D792 |
| Hardness | 70 | Shore OOO | ASTM D2240 |
| TML | <0.1 | % | By LiPOLY |
| Application temperature | -60~150 | °C | – |
| ROHS & REACH | Compliant | – | – |
| THERMAL | |||
| Thermal conductivity | 24.0 | W/m·K | ASTM D5470 |
| Thermal conductivity | 15.0 | W/m·K | ISO 22007-2 |
| Thermal impedance@10psi | 0.085 | °C-in²/ W | ASTM D5470 |
