Masstech Global Co., Ltd.

แผ่นนำความร้อน LiPOLY T-TOP 99-s

Ultra Thermal Pad 24 W/m·K

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Datasheet Download

 

T-top99-s Extreme Thermal Pad is an ultra-high thermal conductivity pad with a thermal conductivity of 24.0 W/m*K. It features excellent electrical insulation, compressibility, and flexibility characteristics, specifically designed for uneven surface applications, capable of filling micro gaps and reducing contact thermal resistance.

FEATURES
  • Thermal Conductivity:24.0 W/m·K
  • High compression rate
  • Extremely low thermal impedance
  • Excellent insulator
CONFIGURATIONS
  • Sheets form
  • Die-cuts parts
TYPICAL APPLICATION
  • Between CPU and heat sink
  • Between a component and heat sink
  • Flat-panel displays
  • Power supplies
  • High speed mass storage drives
  • Telecommunication hardware
  • 5G base station & infrastructure
  • High-end Chip
Thermal Pads with Other Thermal Conductivity Ratings
  • 2 W/m·K:PK223
  • 4 W/m·K:PK404
  • 5 W/m·K:PK504
  • 6 W/m·K:PK605
  • 7 W/m·K:PK700
Ultra-High Thermal Conductivity Thermal Pad
  • 8 W/m·K:T-top81-s
  • 11 W/m·K:T-work7000
  • 13 W/m·K:T-top91-s
  • 15 W/m·K:T-work8000
  • 18 W/m·K:T-top98-s
  • 20 W/m·K:T-work9000
  • 24 W/m·K:T-top99-s
T-top99-s Thermal Resistance vs. Pressure vs. Compression
T-top99-s 熱阻抗 vs. 壓力值 vs. 變形量
TYPICAL PROPERTIES
Item T-top99-s UNIT TEST METHOD
Color Gray – Visual
Surface tack 2-side/1-side 2 – –
Thickness Customized mm ASTM D374
Density 3.3 g/cm³ ASTM D792
Hardness 70 Shore OOO ASTM D2240
TML <0.1 % By LiPOLY
Application temperature -60~150 °C –
ROHS & REACH Compliant – –
THERMAL
Thermal conductivity 24.0 W/m·K ASTM D5470
Thermal conductivity 15.0 W/m·K ISO 22007-2
Thermal impedance@10psi 0.085 °C-in²/ W ASTM D5470

 

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