Datasheet Download
BS89-s is an Ultra Soft Thermal Gel Pad with extremely high compliance that prevents deformation of PCB and other components during installation due to compression forces. It can fully accommodate positive and negative tolerances in mechanical design. BS89-s features a thermal conductivity of 5.0 W/m*K, Shore OO hardness of 25, offering high flexibility, high compressibility, excellent electrical insulation, and superior self-adhesive properties. Custom die-cutting and shaping services are available to meet customers’ specific requirements for today’s advanced products.
FEATURES
/ Thermal conductivity: 5.0 W/m·K
/ High compression rate
/ Extremely low thermal impedance
/ High recovery
/ Available in a range of thicknesses
CONFIGURATIONS
/ Roll form
/ Sheets form
/ Die-cuts parts
TYPICAL APPLICATION
/ Between CPU and heat sink
/ Between a component and heat sink
/ Notebook computers
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle
Thermal Resistance vs. Pressure vs. Deflection
TYPICAL PROPERTIES
| Item | BS89-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray | – | Visual |
| Surface tack 2-side/1-side | 2 | – | – |
| Thickness | Customized | mm | ASTM D374 |
| Density | 3.0 | g/cm³ | ASTM D792 |
| Hardness | 25 | Shore OO | ASTM D2240 |
| Application temperature | -60~180 | °C | – |
| Dielectric breakdown | 12 | KV/mm | ASTM D149 |
| ROHS & REACH | Compliant | – | – |
| THERMAL | |||
| Thermal conductivity | 5.0 | W/m*K | ASTM D5470 |
| Thermal impedance@10 psi | 0.318 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.194 | °C-in²/ W | ASTM D5470 |
