Datasheet Download
Thermal EMI Shielding Pad NT94 is made of non-silicone resin materials with no low molecular siloxane volatilization, featuring a composite pad that combines thermal conductivity and electromagnetic wave absorption functions. This gap filler material has a thermal conductivity of 4.0 W/m·K, operates in the frequency range of 10MHz-77GHz, and offers flexibility and compressibility with customizable die-cutting and stamping capabilities.
FEATURES
/ Thermal conductivity: 4.0 W/m·K
/ Excellent absorption characteristics
/ Naturally tacky for ease of manufacture
/ Reworkable
CONFIGURATIONS
/ Sheets form
/ Die-cuts parts
TYPICAL APPLICATION
/ IC, CPU, MOS, LED, M/B, Heat sink
/ LCD-TV, Notebook PC, PC, Telecom device, Wireless hub
/ DDR II module, DVD applications, Hand-set applications
/ 5G base station & infrastructure
// 2.4 GHz Wi-Fi Router , Bluetooth
// 3.5 GHz 5G Mobile Networks
// 5.0 GHz Wi-Fi Router
// 12~18 GHz Low Earth Orbit (LEO) System
// 28 GHz 5G Mobile Networks
// 39 GHz 5G Mobile Networks
Attenuation
TYPICAL PROPERTIES
| Item | NT94 | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Dark Gray | – | Visual |
| Surface tack 2-side/1-side | 2 | – | – |
| Thickness | 0.50~5.0 | mm | ASTM D374 |
| Density | 3.6 | g/cm³ | ASTM D792 |
| Hardness | 65 | Shore OO | ASTM D2240 |
| Application temperature | -60~125 | °C | – |
| Surface resistivity | >10¹² | Ohm | ASTM D257 |
| ROHS & REACH | Compliant | – | – |
| THERMAL | |||
| Thermal conductivity | 4.0 | W/m·K | ASTM D5470 |
| Thermal impedance@10 psi | 0.463 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.128 | °C-in²/ W | ASTM D5470 |
