Masstech Global Co., Ltd.

PR27 / PR27S High-Insulating Thermal Conductive Film

1.8W/m·K

Product Category

Datasheet Download

 

PR27 Polyimide Thermal Conductive Insulation Sheet features a thermal conductivity of 1.8 W/m·K, combining excellent high dielectric constant and low thermal resistance properties. With outstanding high-temperature resistance, operating temperature range from -60℃ to 180℃, dielectric breakdown voltage reaching 8-12KV, superior tensile strength and high-torque screw fastening resistance. Ideal choice for high-power semiconductors and electrical equipment applications, demonstrating high stability characteristics with customizable die-cutting services available.

 

FEATURES

/ Thermal conductivity: 1.8 W/m·K
/ Excellent insulator
/ Extremely low thermal impedance
/ Reworkable

CONFIGURATIONS

/ Roll form
/ Sheets form
/ Die-cuts parts
/ Single-sided adhesive or double-sided adhesive can be used as required

TYPICAL APPLICATION

/ Power supplies
/ Motor controls
/ Power semiconductors
/ 5G base station & infrastructure
/ EV electric vehicle

Thermal Resistance vs. Pressure
TYPICAL PROPERTIES
Item PR27 UNIT TEST METHOD
Color Gray Visual
Surface tack 2-side/1-side
Reinforced layer Polyimide
Thickness 0.10 | 0.125 | 0.15 mm ASTM D374
Density 1.5 g/cm³ ASTM D792
Hardness 80 Shore A ASTM D2240
Application temperature -60~180 °C
ROHS & REACH Compliant
THERMAL
Thermal conductivity 1.8 W/m·K ISO22007-2
Thermal impedance@20psi 0.441 °C-in²/ W ASTM D5470
Thermal impedance@100psi 0.329 °C-in²/ W ASTM D5470

 

 



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