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Silicone thermal putty is a thermal interface material made from a silicone base combined with thermally conductive powders, blended using specialized equipment. It offers excellent thermal conductivity, insulation, and high-temperature resistance. Widely used in electronics, automotive, and LED industries, it enhances heat dissipation efficiency and extends product lifespan by effectively transferring heat from heat-generating components to heat sinks.
FEATURES
/ Thermal conductivity: 3.5 W/m·K
/ Bond line thickness: 100-3000µm
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression andlow stress application
CONFIGURATIONS
/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg
TYPICAL APPLICATION
/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| Item | H-putty | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Blue | – | Visual |
| Resin Base | Silicone | – | – |
| Viscosity | 15000 | Pa.s | DIN 53018 |
| Density | 3.0 | g/cm³ | ASTM D792 |
| Application temperature | -60~180 | °C | – |
| Bond Line Thickness | 100~3000 | μm | – |
| Dielectric breakdown | 12 | KV/mm | ASTM D149 |
| ROHS & REACH | Compliant | – | – |
| THERMAL | |||
| Thermal conductivity | 3.5 | W/m*K | ASTM D5470 |
| Thermal impedance@10psi / 60°C | 0.076 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50psi / 60°C | 0.069 | °C-in²/ W | ASTM D5470 |
