Datasheet Download
Silicone thermal pad T-work9000 is a thermal management material specifically engineered for high-efficiency heat transfer, primarily designed to fill the gaps between heat-generating components and heat sinks. With excellent electrical insulation and compressibility, its flexible nature effectively fills microscopic gaps, increasing the thermal contact area and significantly enhancing heat dissipation performance. Custom cutting and die-cutting services are available. Suitable for electronics, LED, power supply equipment, and other applications requiring thermal management.
FEATURES
- Thermal Conductivity：20.0 W/m·K
- High compression rate
- Extremely low thermal impedance
- Excellent insulator
CONFIGURATIONS
- Sheets form
- Die-cuts parts
TYPICAL APPLICATION
- Between CPU and heat sink
- Between a component and heat sink
- Flat-panel displays
- Power supplies
- High speed mass storage drives
- Telecommunication hardware
- 5G base station & infrastructure
- High-end Chip
Thermal Pads with Other Thermal Conductivity Ratings
- 2 W/m·K：PK223
- 4 W/m·K：PK404
- 5 W/m·K：PK504
- 6 W/m·K：PK605
- 7 W/m·K：PK700
Ultra-High Thermal Conductivity Thermal Pad
- 8 W/m·K：T-top81-s
- 11 W/m·K：T-work7000
- 13 W/m·K：T-top91-s
- 15 W/m·K：T-work8000
- 18 W/m·K：T-top98-s
- 20 W/m·K：T-work9000
- 24 W/m·K：T-top99-s
T-work9000 Thermal Resistance vs. Pressure vs. Compression
TYPICAL PROPERTIES
| Item | T-work9000 | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Brown | – | Visual |
| Surface tack 2-side/1-side | 2 | – | – |
| Thickness | Customized | mm | ASTM D374 |
| Density | 3.3 | g/cm³ | ASTM D792 |
| Hardness | 65 | Shore OOO | ASTM D2240 |
| TML | <0.1 | % | By LiPOLY |
| Application temperature | -60~150 | °C | – |
| ROHS & REACH | Compliant | – | – |
| THERMAL | |||
| Thermal conductivity | 20.0 | W/m·K | ASTM D5470 |
| Thermal conductivity | 12.0 | W/m·K | ISO 22007-2 |
| Thermal impedance@10psi | 0.110 | °C-in²/ W | ASTM D5470 |
