Datasheet Download
Non-silicone thermal pads do not cause electrical contact or contamination issues. With the core advantage of “zero silicone contamination,” they have become an irreplaceable choice for sensitive applications in optics, medical, and semiconductor fields. As the electronics industry advances toward higher integration, higher power, and greater precision, the demand for non-silicone thermal pads will shift from being a “silicone material alternative” to an “essential solution for specific high-end applications.”
FEATURES
Thermal conductivity: 17.0 W/m・K
/ It’s made by non-silicone resin materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and sensitive electric components
/aerospace
CONFIGURATIONS
/ Sheets form
/ Die-cuts parts
TYPICAL APPLICATION
/ High speed mass storage drives
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle
Thermal Resistance vs. Pressure vs. Deflection
TYPICAL PROPERTIES
| Item | N800C | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray | – | Visual |
| Surface tack 2-side/1-side | 2 | – | – |
| Thickness | Customized | mm | ASTM D374 |
| Density | 3.3 | g/cm³ | ASTM D792 |
| Hardness | 50 | Shore OO | ASTM D2240 |
| Application temperature | -60～130 | °C | – |
| Low molecular Siloxane(D3 to D20 total) | N.D | % | Gas Chromatography |
| Total Mass Loss (TML) | ≤ 1.0 | % | ASTM E595 |
| Collected Volatile Condensable Materials （CVCM） | ≤ 0.1 | % | ASTM E595 |
| Water Vapor Regained（WVR） | ≤ 0.02 | % | ASTM E595 |
| RoHS & REACH | Compliant | – | – |
| COMPRESSION@1.0mm | |||
| Deflection @10 psi | 8 | % | ASTM D5470 modify |
| Deflection @20 psi | 28 | % | ASTM D5470 modify |
| Deflection @30 psi | 55 | % | ASTM D5470 modify |
| ELECTRICAL | |||
| Dielectric breakdown | 8 | KV/mm | ASTM D149 |
| Surface resistivity | >1011 | Ohm | ASTM D257 |
| Volume resistivity | >1010 | Ohm-m | ASTM D257 |
| THERMAL | |||
| Thermal conductivity | 17.0 | W/m·K | ASTM D5470 |
| Thermal impedance@10 psi | 0.122 | °C·in²/W | ASTM D5470 |
| Thermal impedance@20 psi | 0.103 | °C·in²/W | ASTM D5470 |
| Thermal impedance@30 psi | 0.058 | °C·in²/W | ASTM D5470 |
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