Masstech Global Co., Ltd.

แผ่นซิลิโคนนำความร้อน Minoru TGxx

MINORU TGxx series thermally conductive PAD can used between electronic devices and heat sink interfaces.

Product Category

Product Description

MINORU TGxx series thermally conductive PAD can used between electronic devices and heat sink interfaces. TGxx series products have good compression and thermal conductivity which enable them to fill the gap between the electronic components and the heat sink at very low pressure. It has slight tack that enable easy pre-assembly.

Characteristics :

  • High thermal conductivity, low thermal resistance
  • High AC withstand voltage value
  • High conformability
  • Good resilience, high long-term reliability
  • Multiple thickness options, wide range of applications

Product Name Rule

Silicon thermal pad (2)

Silicon thermal pad

Product Construction

Silicon thermal pad (1)

Typical Applications :

  • Power switch module
  • Automotive control units
  • Universal high voltage interfaces
  • Engine control units
  • Power Conversion Devices
  • Power Semiconductors – MOSFETs and IGBTs
TG20-xx TG30-xx TG40-xx TG50-xx TG60-xx TG80-xx TG90-xx TG100-xx TG120-xx TG150-xx Test method
Thickness(mm) 0.2∽10 0.2∽10 0.2∽10 0.2∽10 0.5∽10 0.5∽10 0.5∽10 0.5∽10 0.5∽10 0.5∽10 —
Color Blue Brown Green Grey Pink Yellow Grey Grey Grey Grey —
Thermal Conductivity

(W/M.K)

2.0 3.0 4.0 5.0 6.0 8.0 9.0 10.0 12.0 15.0 ASTM D5470
Hardness  Shore  00 25 35 40 55 55 60 60 60 70 70 —
Density   (g/cm3, @ 25°C) 2.7 2.9 3.1 3.3 2.6 4.9 5.1 3.7 3.2 3.5 —
Volume resistivity

(Ω-cm)

>3.9*1013 >3.1*1013 >3.1*1013 >3.1*1013 >3.9*1013 >8*1012 >8*1012 >8*1011 >3.1*1013 >3.1*1013 ASTM D257-14
Breakdown Voltage kv/mm >8.8 >8.8 >8.8 >8.9 >11.3 >12 >12 >12 >12 >12 ASTM D149-09
Dielectric Constant 1MHz 4.7 4.8 4.8 6.1 6.3 7.1 11.8 6.9 6.9 7.9 ASTM D150-11
Tensile Strength(psi) 48 45 45 50 50 50 55 60 60 60 ASTM D412
Coefficient of thermal expansion (ppm/°C) 63 63 63 48 48 43 43 43 42 47 IPC-TM-6502.4.24
Outgassing(TML) 0.1% 0.11% 0.11% 0.06% 0.06% 0.06% 0.1% 0.1% 0.1% 0.1% ASTM E595-07
Exasperation(CVCM) 0.025% 0.025% 0.025% 0.025% 0.025% 0.025% 0.03% 0.03% 0.03% 0.03% ASTM E595-07
Flame retardant UL94 V0 Equivalent UL
Working Temperature   (°C) -50°C~200°C —

 

 

— Minoru ตัวแทนจำหน่าย, thermal pad ไม่มีซิลิโคน, แผ่นนำความร้อน, gap filler, PCM thermal pad, phase change material, เทปนำความร้อน, EMI absorber, เทปทองแดง EMI, conductive fabric tape

Rerate Products

แผ่น PCM นำความร้อน Minoru 5505-5510

5505-xx&5507-xx&5508-xx&5510-xx series are phase change thermal pad

TGF One-Part Silicone Gap Filler

TGF series is a thermally conductive Gap Filler

ฟิล์มนำความร้อนพร้อมฉนวนไฟฟ้า LiPOLY PR27

1.8W/m·K

แผ่นฉนวนกันความร้อน LiPOLY AS27

0.012W/m·K
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